Manufacturers of Specialty Fasteners and Seal Products for the Clean-Critical Environments of the 21st Century.
The UC RediVac® product line of screws, washers, and nuts is engineered for faster pump-down and more complete evacuation of vacuum systems, as well as corrosion resistance and galling prevention. RediVac® Seals are cleaned and baked to minimize outgassing under vacuum. All our products are designed for High Vacuum (HV), Ultra High Vacuum (UHV) and Extreme Ultraviolet Lithography (EUV) applications
- Vented Screws, Nuts, Washers, and O-Rings
- Plated, Coated Screws, Nuts, Washers
- Cleaned/Clean and Baked Packaged Fasteners and O-Rings
- Customs, Prototypes, Specials
- Knowledgeable Team for proper product advice
- Faster pump-down under vacuum
- Galling prevention, corrosion resistance
- Contamination control
- Solving problems, speeding production
UC Components, Inc., is a manufacturer of fastener and seal products for clean-critical environments of the 21st century, with a focus on plated, coated, polished, cleaned, and vented screws for High and Ultra High Vacuum equipment. The UC RediVac® product line of screws, washers, and nuts is engineered for faster pump-down and more complete evacuation of vacuum systems, as well as corrosion resistance and galling prevention.
The RediVac® line of cleaned and vacuum-baked fluoroelastomer (FKM) O-rings is designed to deliver a ready-to-use seal to the point of use with a thorough surface cleaning and/or vacuum de-gassing for quicker pump-down and reduced contamination.
Most UC Components products, and all vented screws are available in both Inch and Metric standards.
RediVac® fastener and seal products are cleaned and packaged in a Class100/ISO Class 5 Cleanroom cleanroom environment, making them suitable for a variety of applications in addition to those in the vacuum industry. Reduce contamination, improve yields, and help boost the performance of your HV, UHV, EUV or clean-critical system with UC Components RediVac® vented screws and seals.
News / Trade show
|ICMCTF 46 (5/19-5/24/19) – Town & Country Convention Center, San Diego, CA - Booth 222 The Conference features a two-day industrial exhibition, Tuesday and Wednesday, May 21-22, showcasing the latest in equipment, materials, and services used for the deposition, monitoring, and characterization of coatings and thin films. The Exhibition is open to the public. An educational program of Short Courses and Focused Topic Sessions (FTS) will be offered throughout the week.
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|EIPBN 2019 (5/28-5/31/19) – Hyatt Regency Minneapolis - Minneapolis, Minnesota - The EIPBN Conference is dedicated to lithographic patterning science, nanomanufacturing process technology, and the applications these methods enable. For 62 years and 63 meetings, the conference has brought together engineers and scientists from industries and universities from all over the world to report on and discuss recent progress and future trends.
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|SEMICON West (7/10 - 7/12/19) – Moscone Center, San Francisco, CA - Booth 5452 - SEMICON West is where the semiconductor industry goes to keep up with developments in rapidly changing industry. Three days of presentations with more than 80+ hours of technical and business programming, plus hundreds of exhibitors provide the insights, innovations, and intelligence you need to get ahead and embrace today’s disruptive landscape. You’ll gain access to the best in the business and get a glimpse at what’s next. Immersive, new experiences demonstrating hot-buttons like Smart Transportation, Smart Manufacturing, MedTech, Big Data, IoT, and the cognitive technologies that are transforming the world make this year’s Expo like no other before.
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|ALD 2019 (7/21 - 7/24/19) – Hyatt Regency Bellevue, Bellevue, WA The AVS 19th International Conference on Atomic Layer Deposition (ALD 2019) featuring the 6th International Atomic Layer Etching Workshop (ALE 2019) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and now topics related to atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe, and Asia, allowing the fruitful exchange of ideas, know-how, and practices between scientists. This year, the ALD conference will again incorporate the Atomic Layer Etching 2019 Workshop (ALE 2019), so that attendees can interact freely
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